ST0095 Манг manganese медный (Mn/Cu) мишень для напыления

Manganese Copper (Mn/Cu) Sputtering Target Description

The Manganese Copper (Mn/Cu) Sputtering Target is engineered for high efficiency in sputtering deposition processes. Manufactured to achieve excellent purity (≥99%), this target is ideal for creating uniform thin films in semiconductor, display, and microelectronics applications. Its customizable shapes, including discs and bespoke designs, make it versatile for various industrial requirements. Leveraging advanced fabrication techniques, our product ensures reliable performance and minimal contamination during deposition.

Manganese Copper (Mn/Cu) Sputtering Target Applications

· Thin Film Deposition: Essential for fabricating uniform coatings in semiconductor and display manufacturing.
· Microelectronics: Used in the production of integrated circuits and other high-precision electronic components.
· Surface Coating: Provides excellent adhesion and uniformity in decorative and protective coatings.
· Research & Development: Ideal for laboratory settings focused on material sciences and advanced alloys. 

Manganese Copper (Mn/Cu) Sputtering Target Packing

Our Manganese Copper Sputtering Targets are handled with care to ensure they remain in pristine condition throughout their journey.
Packaging Options: Vacuum-sealed packaging and custom containers available based on client requirements.

Frequently Asked Questions

Q: What is the primary application of the Manganese Copper (Mn/Cu) Sputtering Target?
A: It is primarily used for thin film deposition in semiconductor, display, and microelectronics industries.

Q: Can the shape of the sputtering target be customized?
A: Yes, the product is available in standard disc shapes or can be custom-made to suit specific application needs.

Q: What ensures the high performance of this sputtering target during deposition processes?
A: Its high purity (≥99%) and uniformly fabricated design guarantee minimal contamination and consistent film quality.

Q: Is it possible to modify the bonding method of the target?
A: The target typically uses Indium and Elastomer bonds, but custom bonding options may be available upon request.

Q: How should the sputtering target be packaged to maintain its performance?
A: The targets are vacuum-sealed in specialized packaging designed to protect them from environmental factors and ensure their quality during transportation.