Снято с производства (Снято с производства) Целевой сплошной материал окиси циркония-титана (PbZr0,52Ti0,48O3)

Lead Zirconium Titanate (PbZr0.52Ti0.48O3) Sputtering Target Description

The Lead Zirconium Titanate (PbZr0.52Ti0.48O3) Sputtering Target is engineered for high-precision applications in sputtering processes. Designed to meet the challenging requirements of modern electronics and advanced material coating, this target offers exceptional purity and performance. Its high-quality characteristics ensure consistency and reliability in various high-tech industrial applications.

Lead Zirconium Titanate (PbZr0.52Ti0.48O3) Sputtering Target Applications

· Electronics Fabrication: Ideal for producing thin films used in advanced microelectronics.
· Surface Coating: Provides uniform and consistent layers in coating applications.
· Advanced Material Research: Supports development and testing in materials science laboratories.
· Customized Industrial Processes: Available in custom-made shapes to suit specific process requirements.

Lead Zirconium Titanate (PbZr0.52Ti0.48O3) Sputtering Target Packing

Our sputtering targets are carefully packaged under controlled conditions to maintain their performance quality. Each target is vacuum-sealed and clearly labeled. Custom packing options are also provided based on specific customer needs.

Frequently Asked Questions

Q: What types of sputtering methods can be used with this target?
A: This target supports RF, RF-R, and DC sputtering methods.

Q: How does the high purity (≥99%) affect the performance of the sputtering process?
A: High purity ensures minimal impurities, which leads to consistent film quality and reliable performance in critical applications.

Q: Can the shapes and sizes of the sputtering target be customized?
A: Yes, in addition to standard disc shapes, custom-made options are available to meet unique production requirements.

Q: What industries typically utilize Lead Zirconium Titanate Sputtering Targets?
A: Industries such as electronics manufacturing, surface coating, and advanced materials research commonly use these sputtering targets.

Q: How is the density of ~8.0 g/cm³ significant for the target's performance?
A: The specified density is crucial for achieving the desired structural integrity and performance during the sputtering process, ensuring uniform deposition.